By Topic

Thermal Stress Birefringence in Buried-Core Waveguides With Over-Etch

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Patrick Dumais ; Communications Research Centre Canada, Ottawa, Canada

Thermal stress birefringence in buried-core waveguides is studied analytically and numerically to determine the role of cladding and core composition, core aspect ratio and over-etch depth. An analytical expression is derived for the over-etch depth required for stress birefringence compensation. Analytical expressions for the core stress are given for over-etched rectangular buried-core waveguides. The range of upper cladding thermal expansion coefficient over which stress birefringence compensation can be obtained through over-etching is established.

Published in:

IEEE Journal of Quantum Electronics  (Volume:47 ,  Issue: 7 )