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Thermal Stress Birefringence in Buried-Core Waveguides With Over-Etch

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1 Author(s)
Dumais, P. ; Commun. Res. Centre Canada, Ottawa, ON, Canada

Thermal stress birefringence in buried-core waveguides is studied analytically and numerically to determine the role of cladding and core composition, core aspect ratio and over-etch depth. An analytical expression is derived for the over-etch depth required for stress birefringence compensation. Analytical expressions for the core stress are given for over-etched rectangular buried-core waveguides. The range of upper cladding thermal expansion coefficient over which stress birefringence compensation can be obtained through over-etching is established.

Published in:

Quantum Electronics, IEEE Journal of  (Volume:47 ,  Issue: 7 )

Date of Publication:

July 2011

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