By Topic

Test structures for investigation of metal coverage effects on MOSFET matching

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Tuinhout, H.P. ; Philips Res. Lab., Eindhoven, Netherlands ; Vertregt, M.

An extensive set of test structures for characterization of effects of metal coverage on MOSFET matching is presented. These structures prove very useful for evaluation of MOSFET mismatch effects associated with interface states and local mechanical stress differences caused by metal lines running over matched pairs. Better understanding and control of these effects is extremely important for improving advanced mixed signal ICs in modern Multi Level Metal CMOS processes

Published in:

Microelectronic Test Structures, 1997. ICMTS 1997. Proceedings. IEEE International Conference on

Date of Conference:

17-20 Mar 1997