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A 65fJ/b Inter-Chip Inductive-Coupling Data Transceivers Using Charge-Recycling Technique for Low-Power Inter-Chip Communication in 3-D System Integration

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5 Author(s)
Kiichi Niitsu ; Department of Electronics and Electrical Engineering, Keio University ; Shusuke Kawai ; Noriyuki Miura ; Hiroki Ishikuro
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This paper presents a low-power inductive-coupling link in 90-nm CMOS. Our newly proposed transmitter circuit uses a charge-recycling technique for power-aware 3-D system integration. The cross-type daisy chain enables charge recycling and achieves power reduction without sacrificing communication performance such as a high timing margin, low bit error rate and high bandwidth. There are two design issues in the cross-type daisy chain: pulse amplitude reduction and another is inter-channel skew. To compensate for these issues, an inductor design and a replica circuit are proposed and investigated. Test chips were designed and fabricated in 90-nm CMOS to verify the validity of the proposed transmitter. Measurements revealed that the proposed cross-type daisy chain transmitter achieved an energy efficiency of 65 fJ/bit without degrading the timing margin, data rate, or bit error rate. In order to investigate the compatibility of the transmitter with technology scaling, a simulation of each technology node was performed. The simulation results indicate that the energy dissipation can be potentially reduced to less than 10 fJ/bit in 22 nm CMOS with proposed cross-type daisy chain.

Published in:

IEEE Transactions on Very Large Scale Integration (VLSI) Systems  (Volume:20 ,  Issue: 7 )