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Low stress silver-glass die attach materials

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1 Author(s)
Nguyen, M.N. ; Johnson Matthey Electron. Inc., San Diego, CA, USA

The influence of sintering and rheological properties on the performance of silver-glass die attach materials is described. Improved silver-glass material has been developed. Stress relief for large-area dice gives void- and crack-free die bonding. This is achieved by controlling the sintering rate via additive technology. Precise rheology for high-speed dispensing in a tight cavity is possible by implementing the Y, E, and n rheological criteria in the manufacturing control. Single-pass firing with no predrying for large area dice (500 mils or larger) is possible

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Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:13 ,  Issue: 3 )