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Consideration of thermal constraints during multichip module placement

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2 Author(s)
Man Chak Tang ; Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ ; Carothers, J.D.

A multichip module placement algorithm which handles heat distribution as well as traditional placement objectives is presented. The algorithm uses a combined quad-partitioning genetic search, and simulated annealing technique. Experimental results show improvements in the min-cut and simulated annealing algorithms, in terms of net length, while satisfying the heat distribution constraints

Published in:

Electronics Letters  (Volume:33 ,  Issue: 12 )

Date of Publication:

5 Jun 1997

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