Cart (Loading....) | Create Account
Close category search window

Applying yield impact models as a first pass in upgrade decisions [semiconductor manufacturing]

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
McIntyre, M.G. ; Contamination Free Manuf. Sect., Adv. Micro Devices Inc., Austin, TX, USA ; Meitz, J.

As a semiconductor manufacturing leader, AMD fully utilizes all available defect inspection technologies to maintain a comprehensive dynamic yield management program. By obtaining, filtering and finally correlating all defect information AMD has been able to develop yield impact ratios for all commonly identified particles. These impact ratios are then combined to form a yield model used in predicting fab die per wafer (DPW) levels. The focus of this report is on the application of the yield model, and impact ratios used to determine whether it is cost effective to upgrade equipment. Applications illustrating the incorporation of various devices, volumes and technologies are looked at in putting together generic formula guidelines

Published in:

Advanced Semiconductor Manufacturing Conference and Workshop. 1994 IEEE/SEMI

Date of Conference:

14-16 Nov 1994

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.