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Detection tests of imaging devices based on silicon pixel-array detectors assembled using Tape Automated Bonding and microcable technologies

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20 Author(s)
V. Borshchov ; State Enterprise Scientific Research Technological Institute of Instrument Engineering (SE SRTIIE), Kharkov, Ukraine ; D. Burdette ; E. Chesi ; V. Cindro
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Detection and spectroscopic tests of three self-triggered silicon detection modules constructed using Tape Automated Bonding and micro-cable technologies and equipped by VATA read-out chips are presented and compared. Results of these tests are demonstrated using hit maps and pulse-height spectra induced by 133Ba, 241Am, and 57Co radioactive sources of X- and gamma rays. We have observed significant improvement in measurement of hit maps in the cases of first and second detector modules. The hit maps of the first detector module have proven that some problems occur in addressing certain VATA chip channels. Whereas, the hit maps of the second detector module is correct. On the other side, spectroscopic resolution given by the Full Width at Half Maximum (FWHM) of the first detection module is below 2 keV which is compatible with measurements on wire bonded modules. The FWHM of the second module is approximately two times worse.

Published in:

IEEE Nuclear Science Symposuim & Medical Imaging Conference

Date of Conference:

Oct. 30 2010-Nov. 6 2010