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Three-Dimensional Photoacoustic Imaging by a CMOS Micromachined Capacitive Ultrasonic Sensor

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4 Author(s)
Meng-Lin Li ; Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan ; Po-Hsun Wang ; Pei-Liang Liao ; Lu, M.S.-C.

In this letter, we demonstrate the feasibility of 3-D photoacoustic imaging using a monolithic CMOS micromachined capacitive ultrasonic sensor. The sensing membranes are released by a post-CMOS metal etch and sealed by silicon dioxide. Nine membranes, each with an inner diameter of 60 μm, form a single detection unit with a capacitance value of 292.5 fF. A 6- μm carbon fiber was employed to evaluate the 3-D photoacoustic imaging capability and resolution of our sensor. A 2-D large-aperture array was emulated by 2-D mechanical scanning of a single sensing element with a scanning step of 120 μm. A 2-D synthetic aperture focusing technique was used for image reconstruction. The measured -6-dB spatial resolutions were 181 μm in axial and 448 μm in lateral, respectively, at the depth of ~ 2.4 cm. The 3-D photoacoustic image of a carbon fiber phantom was successfully produced.

Published in:

Electron Device Letters, IEEE  (Volume:32 ,  Issue: 8 )