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Optoelectronic packaging technology development of a high density 32-channel 16 Gbps optical data link for the optoelectronic technology consortium (OETC)

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7 Author(s)

Summary form only given. A parallel, 32 channel, high density (140 μm pitch) 500 Mbps/channel NRZ optical data link has been successfully fabricated using existing GaAs IC, silicon optical bench, and multichip module technologies. Packaging designs, its implementation, and link characterization will be discussed

Published in:

Lasers and Electro-Optics Society Annual Meeting, 1994. LEOS '94 Conference Proceedings. IEEE  (Volume:1 )

Date of Conference:

31 Oct-3 Nov 1994