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Packaging issues for next generation high voltage, high temperature power electronic modules

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3 Author(s)
Bowers, J.S. ; Custom Electron. Inc., Oneonta, NY, USA ; Hopkins, D.C. ; Sarjeant, W.J.

This paper describes packaging issues related to the next generation of high voltage (>2 kV), high temperature (200°C to 400°C) power electronic modules that are being developed for military, commercial and industrial applications. These applications include space, nuclear power and down-hole systems. Components, materials and processes are considered. Effects due to variations in thickness of the copper interconnect, ceramic substrate and heat spreader (baseplate) are investigated to predict the effects of thermally induced stresses. Thinner ceramic layers provide a significant increase in the thermal conductance and lower thermally induced stresses during system operation

Published in:

Applied Power Electronics Conference and Exposition, 1997. APEC '97 Conference Proceedings 1997., Twelfth Annual  (Volume:1 )

Date of Conference:

23-27 Feb 1997