By Topic

The use of multichip module technology for power electronics miniaturization and packaging

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Burgers, K.C. ; Dept. of Electr. Eng., Arkansas Univ., Fayetteville, AR, USA ; Olejniczak, K.J. ; Ang, S.S. ; Porter, E.

This paper describes the design and fabrication of a highly integrated, intelligent, integral horsepower, three-phase induction motor drive based on multichip module (MCM) technology. This solid-state controller-known as a multichip power module (MCPM)-uses known good die to obtain minimal footprint, volume, and mass, while maximizing efficiency, reliability, and manufacturability

Published in:

Applied Power Electronics Conference and Exposition, 1997. APEC '97 Conference Proceedings 1997., Twelfth Annual  (Volume:1 )

Date of Conference:

23-27 Feb 1997