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Al/SiC for power electronics packaging

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1 Author(s)
Premkumar, M.K. ; Alcoa Composite Components, Alcoa Center, PA, USA

Al/SiC composites have a CTE that very closely matches ceramics along with a high thermal conductivity. In addition, these composites also have an elastic modulus that is 2× that of Cu and a density that is 66% less than that of Cu. These properties allow for a package design that is significantly superior to the traditional Cu baseplate design. This presentation discusses the unique properties of Al/SiC as it applies to power electronics packaging. The results of thermal cycling and other reliability testing of Al/SiC products are presented and discussed

Published in:

Advanced Packaging Materials. Proceedings., 3rd International Symposium on

Date of Conference:

9-12 Mar 1997

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