By Topic

Microwave characterization of low temperature cofired ceramic system

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
S. Vasudevan ; Electron. Mater. Div., Ferro Corp., Santa Barbara, CA, USA ; A. Shaikh

Low Temperature Cofired Ceramic (LTCC) is a multilayer electronic packaging technology and has a unique ability to integrate passive components such as resistors, capacitors and inductors in a monolithic package. The LTCC can be used to make electronic circuits with high density interconnects and complex shape buried components. LTCC Technology has been extensively explored in the microelectronics industry as a ceramic packaging technology for integrated microcircuits. Ferro's A6 tape has a dielectric constant of 6 and low microwave losses of <0.17 dB/in at 10 GHz. The high frequency (GHz range) audio and video transmission application is expected to expand very rapidly in the near future. Microelectronic packages for high frequency application require conductive materials with high conductivity and dielectrics with low losses at microwave frequency range. The objective of the paper is to characterize the Ferro A6 LTCC system in the microwave frequency range. Ring resonator designs were used to characterize microwave properties of A6 LTCC packages with Ag, Au and Ag, Au mixed conductor systems. The effect of processing parameters such as peak firing temperature and time on microwave characteristics of LTCC system was studied. The effect of processing parameters on Q factor and microwave losses were studied and presented. The effect of conductor type and its surface roughness on microwave properties is also presented

Published in:

Advanced Packaging Materials. Proceedings., 3rd International Symposium on

Date of Conference:

9-12 Mar 1997