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Electrical performance in time domain of subminiature interconnections on new thin films

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4 Author(s)
Salik, R. ; Silvaco Int., Santa Clara, CA, USA ; Ferrari, P. ; Chosson, A. ; Angnieux, G.

This paper is focused on transmission lines with dimensions comparable to future VLSI interconnections (except for the transmission line width which is equal to 5 μm, whereas the width of future interconnections will probably be less than 1 μm). The goal is to show on which characteristic the effort must be made. To achieve this, the propagation of fast signals along the transmission lines is studied in the time domain. The effect of the insulator on electrical delay and distortion are pointed out. A Fourier transform is used to give the propagation constant γ(ω)=α(ω)+jβ(ω) of the transmission lines in the frequency domain. Results are compared to those obtained by a full wave frequency domain modeling method (TRM)

Published in:

Advanced Packaging Materials. Proceedings., 3rd International Symposium on

Date of Conference:

9-12 Mar 1997