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Low cost solder flip chip

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2 Author(s)
Rinne, G.A. ; MCNC Interconnection & Packaging Technol., Research Traingle Park, NC, USA ; Magill, P.A.

Since the advent of flip chip packaging technology in the solid logic technology (SLT) of IBM in the early 1960s, a great deal of thought and energy has been invested toward making flip chip cost competitive with wirebonding. While this goal has been occasionally met in the intervening years, the relentless progress of wirebond technology has repeatedly regained the advantage

Published in:

Advanced Packaging Materials. Proceedings., 3rd International Symposium on

Date of Conference:

9-12 Mar 1997