By Topic

Hydrolytically stable aluminum nitride as a filler material for polymer based electronic packaging

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
K. E. Howard ; Dow Chem. Co., Midland, MI, USA ; A. K. Knudsen

A new filler material, SCAN, silica-coated aluminum nitride, has been developed by The Dow Chemical Company for microelectronic plastic packaging. SCAN is a hydrolytically stable aluminum nitride material with appropriate particle size distribution and thermal conductivity to be used as a filler material for molding compounds or glob-tops where power dissipation is required. The patented silica coating process imparts hydrolytic stability to the powder and modifies the surface chemistry to make it more compatible with resin formulations that have traditionally used fused silica

Published in:

Advanced Packaging Materials. Proceedings., 3rd International Symposium on

Date of Conference:

9-12 Mar 1997