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New material technology for high density interconnections

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1 Author(s)
Johnson, D.D. ; W.L. Gore & Assoc., Elkton, MD, USA

A new technology is discussed that allows for the efficient interconnection of Surface Mounted Components (SMC) to high density substrates. This technology is based on the selective through metalization of porous, expanded polytetrafluoroethylene (ePTFE) membranes using a photoimaging process. The selective metalized membrane can be coated or filled with resins or adhesives to yield an Anisotropic Z-Axis Interface

Published in:

Advanced Packaging Materials. Proceedings., 3rd International Symposium on

Date of Conference:

9-12 Mar 1997

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