Referenced Items are not available for this document.
A new technology is discussed that allows for the efficient interconnection of Surface Mounted Components (SMC) to high density substrates. This technology is based on the selective through metalization of porous, expanded polytetrafluoroethylene (ePTFE) membranes using a photoimaging process. The selective metalized membrane can be coated or filled with resins or adhesives to yield an Anisotropic Z-Axis Interface
Published in:
Advanced Packaging Materials. Proceedings., 3rd International Symposium on
Date of Conference: 9-12 Mar 1997
- Page(s):
- 29 - 30
- Meeting Date :
- 09 Mar 1997-12 Mar 1997
- Print ISBN:
- 0-7803-3818-9
- INSPEC Accession Number:
- 5665007
- Conference Location :
- Braselton, GA
- Digital Object Identifier :
- 10.1109/ISAPM.1997.581247
- Product Type:
- Conference Publications
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