By Topic

Practical applications of photo-defined micro-via technology (PhotoLinkTM)

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
B. J. McDermott ; Continental Circuits Inc., FL, USA ; S. Tryzbiak

Current high density SMT designs and many of the future designs, as we move towards Chip-Scale Packaging (CSP), will require increased price/performance of the PCB. Conventional mechanical drilling and blind/buried via technologies are reaching their design limitations. Photoimageable dielectrics may be the most cost effective and the least time to market of the higher density technologies. This is a fundamental change in the way we make PCB's. It will provide the process capability in terms of via size to meet the longer term interconnect density requirements. This technology is available today to enable the implementation of higher density SMT and CSP designs. It provides significant advantages in terms of physical design rules and also electrical design

Published in:

Advanced Packaging Materials. Proceedings., 3rd International Symposium on

Date of Conference:

9-12 Mar 1997