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Design and packaging of a Pentium(R)-processor-based MCM-D module for wearable personal computers, notebooks, and embedded control applications

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3 Author(s)
Mok, S. ; MicroModule Syst., Cupertino, CA, USA ; Reinschmidt, R. ; Smith, L.

We describe two generations of Pentium(R)-processor based MCMs. We identify the driving factors for the design, describe the designs, discuss the design issues and solutions, and report on results from thermal and EMI tests

Published in:

Multichip Modules, 1997., International Conference on

Date of Conference:

2-4 Apr 1997