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Power noise suppression technique using active decoupling capacitor for TSV 3D integration

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3 Author(s)
Tien-Hung Lin ; Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan ; Po-Tsang Huang ; Wei Hwang

In three-dimensional (3D) integration, the increasing supply current through both package and through-silicon-via (TSV) would lead to a large simultaneous switching noise potentially. In this paper, a noise suppression technique using low power active decoupling capacitors (DECAPs) is proposed for TSV 3D integration. Through the latch-based noise detection circuitry, the power supply noise can be detected and regulated via active DECAPs. Based on UMC 65 nm CMOS technology and TSV model at 1 V supply voltage, the proposed noise suppression circuit can realize maximum 7.4 dB supply noise reduction and 12 X boost fact at the resonant frequency.

Published in:

SOC Conference (SOCC), 2010 IEEE International

Date of Conference:

27-29 Sept. 2010