Referenced Items are not available for this document.
Smart Stacking™ is a wafer-to-wafer stacking technology of partially or fully processed wafers. This technology enables transferring very thin layers in a high volume manufacturing environment. The core technologies are surface conditioning, low temperature direct bonding and wafer thinning (figure 1). This technology is adapted for advanced semiconductor applications such as Back Side Illumination (BSI) CMOS Image Sensors (CIS) as well as 3D integration approaches.
Published in:
IC Design & Technology (ICICDT), 2011 IEEE International Conference on
Date of Conference: 2-4 May 2011
- Page(s):
- 1 - 4
- ISSN :
- Pending
- Print ISBN:
- 978-1-4244-9019-6
- INSPEC Accession Number:
- 12034581
- Conference Location :
- Kaohsiung
- Digital Object Identifier :
- 10.1109/ICICDT.2011.5783202
- Product Type:
- Conference Publications
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