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Ultrathin Silicon Chips of Arbitrary Shape by Etching Before Grinding

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3 Author(s)
Herwik, S. ; Dept. of Microsyst. Eng., Univ. of Freiburg, Freiburg, Germany ; Paul, O. ; Ruther, P.

A complementary-metal-oxide-semiconductor-compatible fabrication technique for ultrathin silicon chips of arbitrary shape is reported. It combines deep reactive ion etching and wafer grinding to define the in-plane geometry and thickness of the chips, respectively. Neural probes with shaft lengths up to 12 mm and thicknesses down to 25 μm were fabricated.

Published in:

Microelectromechanical Systems, Journal of  (Volume:20 ,  Issue: 4 )