Cart (Loading....) | Create Account
Close category search window
 

In-situ test study on hydraulic fills ground improvement by high vacuum compact method

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Qingzhi Yan ; Inst. of Storage-Transp. & Archit. Eng., China Univ. of Pet., Qingdao, China ; Yanhua Wang ; Liqun Jiang

Combined traditional soft ground improvement methods, high vacuum compact method of using alternately high vacuum drainage and dynamic consolidation to accelerate the dissipation of excess pore water pressure and the consolidation of soft soil has been proposed in this paper. The in-situ test has been studied for a hydraulic fill ground improvement in Yellow River Delta region, and construction process, the test parameters, soil deformation, excess pore water pressure and improvement effect have also been analyzed. High vacuum compact method is a time-saving, effective and low-cost soft soil improvement method, which can be suitable for hydraulic fills ground improvement in Yellow River Delta region.

Published in:

Electric Technology and Civil Engineering (ICETCE), 2011 International Conference on

Date of Conference:

22-24 April 2011

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.