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Microprocessor system applications and challenges for through-silicon-via-based three-dimensional integration

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3 Author(s)
Karnik, T. ; Intel Labs., Intel Corp., Hillsboro, OR, USA ; Somasekhar, D. ; Borkar, S.

Promise of form-factor reduction and hybrid process integration by three-dimensional (3D)-stacked integrated circuits (3DICs) has spurred interest in both academia and industry. In this study, through-silicon-via (TSV)-based 3D integration is discussed from a microprocessor centric view. The authors present the challenges faced by technology scaling and provide 3D integration as a possible solution. The applications for 3DICs are discussed with details of a few prototypes. The issues and challenges associated with 3D integration technologies are also addressed. TSV-based 3D integration technology will allow integration of diverse functionality to realise energy-efficient and affordable compact systems that will continue to deliver higher performance.

Published in:

Computers & Digital Techniques, IET  (Volume:5 ,  Issue: 3 )