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Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination

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5 Author(s)
Holck, O. ; Fraunhofer Inst. for Reliability & Microintegration (IZM), Berlin, Germany ; Bauer, J. ; Wittler, O. ; Michel, B.
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An investigation of interfacial interaction has been performed between an industry oriented epoxy molding compound Epoxy Phenol Novolac (EPN) and its filled variety EPNF (with silica particles) and a native silicon dioxide layer (SiO2) usually found at chip surfaces. The free surfaces of both solid materials were experimentally analysed by contact angle measurements of three different liquids (water, methylene-iodide (MI) and glycerol). Results are compared to interfacial energies obtained by analysis of the interfaces in bimaterial molecular models, yielding reasonable agreement. A qualitative prediction regarding the influence of water on the interfacial strength between chip and molding compound is attempted.

Published in:
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on

Date of Conference: 18-20 April 2011

Page(s):
1/7 - 7/7
Print ISBN:
978-1-4577-0107-8
INSPEC Accession Number:
11989377
Conference Location :
Linz
Digital Object Identifier :
10.1109/ESIME.2011.5765840

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