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Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination

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5 Author(s)
O. Hölck ; Fraunhofer Institute for Reliability and Microintegration (IZM), Gustav Meyer Allee 25, 13355 Berlin, Germany ; J. Bauer ; O. Wittler ; B. Michel
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An investigation of interfacial interaction has been performed between an industry oriented epoxy molding compound Epoxy Phenol Novolac (EPN) and its filled variety EPNF (with silica particles) and a native silicon dioxide layer (SiO2) usually found at chip surfaces. The free surfaces of both solid materials were experimentally analysed by contact angle measurements of three different liquids (water, methylene-iodide (MI) and glycerol). Results are compared to interfacial energies obtained by analysis of the interfaces in bimaterial molecular models, yielding reasonable agreement. A qualitative prediction regarding the influence of water on the interfacial strength between chip and molding compound is attempted.

Published in:

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on

Date of Conference:

18-20 April 2011