Cart (Loading....) | Create Account
Close category search window
 

A Novel Implementation of Discrete Complex Image Method for Layered Medium Green's Function

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Chen, Y.P. ; Dept. of Electr. & Electron. Eng., Univ. of Hong Kong, Hong Kong, China ; Weng Cho Chew ; Lijun Jiang

A novel implementation of discrete complex image method (DCIM) based on the Sommmerfeld branch cut is pro posed to accurately capture the far-field behavior of the layered medium Green's function as a complement to the traditional DCIM. By contour deformation, the Green's function can be naturally decomposed into branch-cut integration (radiation modes) and pole contributions (guided modes). For branch-cut integration, matrix pencil method is applied, and the alternative Sommerfeld identity in terms of kz integration is utilized to get a closed-form solution. The guided modes are accounted for with a pole-searching algorithm. Both one-branch-cut and two-branch-cut cases are studied. Several numerical results are presented to validate this method.

Published in:

Antennas and Wireless Propagation Letters, IEEE  (Volume:10 )

Date of Publication:

2011

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.