Referenced Items are not available for this document.
A chromium-nickel thin-film thermocouple that is 50 nm thick is demonstrated on a semiconductor substrate as proof of concept for lithographically processed bimetallic on-chip temperature sensors. The Seebeck coefficient of the thin-film thermocouple is calibrated to be 10.37 μV/°C, reproducibly smaller than the bulk literature value by a factor of 3.98. The batch reproducibility of this thin-film Seebeck coefficient is demonstrated. The linear Seebeck response up to 90°C is calibrated with the help of a simple formula which accounts for the temperature variations of the reference thermocouple under large heat loads.
Published in:
Electron Device Letters, IEEE
(Volume:32
,
Issue:
6
)
Date of Publication: June 2011
- Page(s):
- 818 - 820
- ISSN :
- 0741-3106
- INSPEC Accession Number:
- 12021488
- Digital Object Identifier :
- 10.1109/LED.2011.2136314
- Product Type:
- Journals & Magazines
- Date of Publication :
- 05 May 2011
- Date of Current Version :
- 23 May 2011
- Issue Date :
- June 2011
- Sponsored by :
- IEEE Electron Devices Society
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