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Challenges in designing high speed memory subsystem for mobile applications

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4 Author(s)
Tsunwai Gary Yip ; Semiconductor Business Group, Rambus Inc., Sunnyvale, California 94089 USA ; Philip Yeung ; Ming Li ; Deborah Dressler

Some constraints imposed on the design of components for mobile devices are the size of the handheld device, safety for handling, heat dissipation, and in-system electromagnetic interference. This paper discusses challenges in designing the next generation low power DRAM subsystem operating at multi-gigabits per second. A new mobile DRAM interface that can meet the challenges and some test data are presented.

Published in:

2011 Design, Automation & Test in Europe

Date of Conference:

14-18 March 2011