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A Ball Grid Array Package With a Microstrip Grid Array Antenna for a Single-Chip 60-GHz Receiver

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5 Author(s)
Mei Sun ; Inst. for Infocomm Res., Singapore, Singapore ; Yue Ping Zhang ; Duixian Liu ; Kai Meng Chua
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This paper presents the design of a ball grid array package and more importantly describes the integration of a microstrip grid array antenna in the package in a low temperature cofired ceramic (LTCC) technology for a single-chip 60-GHz receiver. The grid array package has a small volume of 13.5 × 8 × 1.265 mm3 and can house a 60-GHz receiver die of current size. The package samples were fabricated and measured. The package part demonstrates low insertion loss <; 0.08 dB and excellent matching with return loss >; 22 dB below 5 GHz; while the antenna part achieves good matching (|S11 | ≤ -10 dB), high efficiency (η >; 88%), and directional patterns with the main beam in the boresight direction from 57 to 64 GHz as well as high gain with the peak value of 14.5 dBi at 60 GHz.

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Antennas and Propagation, IEEE Transactions on  (Volume:59 ,  Issue: 6 )