By Topic

Numerical stress analysis of resin cracking in LSI plastic packages under temperature cyclic loading. II. Using alloy 42 as leadframe material

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Saitoh, T. ; VLSI Packaging Process Dev. Dept., NEC Corp., Kanagawa, Japan ; Toya, M.

For pt. I see ibid., vol. 19, p. 593-600 (1996). In the present paper, we apply the previous analysis to the case where alloy 42 (Fe-42%Ni) is used as the leadframe material. Based on the linear fracture mechanics approach to the bimaterial problem we demonstrate that the delamination occurring between dissimilar materials in alloy 42 leadframe packages quantitatively determines: (a) the degree to which resin cracking occurs; (b) the cracking direction at both the upper and lower wedges of the die pad. The procedure of the analysis and the targeted package are the same as those considered in the previous study. Temperature cyclic tests using actual packages are then also performed to verify the validity of analytical results. The impact of interfacial delamination on resin cracking in alloy 42 leadframe packages is quantitatively determined. It is concluded that the delamination which most easily produces resin cracking is that between the bottom surface of the die pad and the resin while other interfacial delamination (e.g., those at the upper and lower wedge of the die pad) has little impact on resin cracking

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:20 ,  Issue: 2 )