Cart (Loading....) | Create Account
Close category search window

Simultaneous Estimation of Electrical and Thermal Properties of Isotropic Material from the Tone-Burst Eddy Current Thermography (TBET) Time–Temperature Data

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Biju, N. ; Dept. of Mech. Eng., Indian Inst. of Technol. Madras, Chennai, India ; Ganesan, N. ; Krishnamurthy, C.V. ; Balasubramaniam, Krishnan

In this paper, an inversion method is proposed to determine simultaneously the electrical and the thermal properties of a given isotropic material from the time-temperature data obtained from tone-burst eddy current thermography (TBET). A multiphysics forward model for computing the surface temperature data was used in a genetic algorithm (GA) based inversion technique to determine the material properties such as electrical conductivity (σ), thermal conductivity (k), density (ρ), and specific heat (Cp) simultaneously. Different trials were carried out initially with simulated temperature data (with and without noise) and then validated with experiments.

Published in:

Magnetics, IEEE Transactions on  (Volume:47 ,  Issue: 9 )

Date of Publication:

Sept. 2011

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.