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Pixel detectors in 3D technologies for high energy physics

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7 Author(s)
Deptuch, G. ; Fermi Nat. Accel. Lab., Batavia, IL, USA ; Demarteau, M. ; Hoff, J. ; Lipton, R.
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This paper reports on the current status of the development of International Linear Collider vertex detector pixel readout chips based on multi-tier vertically integrated electronics. Initial testing results of the VIP2a prototype are presented. The chip is the second embodiment of the prototype data-pushed readout concept developed at Fermilab. The device was fabricated in the MIT-LL 0.15 μm fully depleted SOI process. The prototype is a three-tier design, featuring 30×30 μm2 pixels, laid out in an array of 48×48 pixels.

Published in:

3D Systems Integration Conference (3DIC), 2010 IEEE International

Date of Conference:

16-18 Nov. 2010