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Equipment challenges and solutions for diverse temporary bonding and de-bonding processes in 3D integration

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5 Author(s)
Gabriel, M. ; SUSS Microtec Lithography GmbH, Garching, Germany ; Bisson, T.K.P. ; Sood, S. ; Bair, W.
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While several methods are available and in production for power devices, LED or other markets, 200 mm and 300 mm temporary bonding for 3D integration is a quite new field for material and equipment suppliers and challenging all participants in the supply chain. These paper presents an overview of existing and emerging processes on a flexible equipment platform to match the requirements of the end user.

Published in:

3D Systems Integration Conference (3DIC), 2010 IEEE International

Date of Conference:

16-18 Nov. 2010

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