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Crosstalk evaluation, suppression and modeling in 3D through-strata-via (TSV) network

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7 Author(s)
Zheng Xu ; Dept. of Electr., Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA ; Beece, A. ; Dingyou Zhang ; Qianwen Chen
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Through-strata-via (TSV) is regarded as a critical component in 3D integration that extends Moore's Law. This paper reports on TSV crosstalk performance under high speed operations using a 3D electromagnetic field solver and a SPICE simulator in both the frequency domain and time domain. Impacts of the rise time, the TSV pitch/height, the substrate resistivity and the guarding TSV termination on crosstalk noise are studied. Effects of adjacent aggressors and their switching patterns on time delay and peak noise of the victim TSV signal are evaluated. For large and dense TSV networks, crosstalk matrices of different TSV line/array arrangements are investigated at certain frequency points, detailing the coupling noise levels among these TSVs. Furthermore, the frequency dependent near-end crosstalk (NEXT) and far-end crosstalk (FEXT) are accurately modeled by SPICE tools.

Published in:

3D Systems Integration Conference (3DIC), 2010 IEEE International

Date of Conference:

16-18 Nov. 2010