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Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment

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9 Author(s)

In this paper the integration challenges related to oxide-oxide bonding for wafer-to-wafer stacking technology are discussed. Furthermore, interface defectivity, wafer-to-wafer alignment and bond strength data are presented.

Published in:

3D Systems Integration Conference (3DIC), 2010 IEEE International

Date of Conference:

16-18 Nov. 2010

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