Referenced Items are not available for this document.
In this paper the integration challenges related to oxide-oxide bonding for wafer-to-wafer stacking technology are discussed. Furthermore, interface defectivity, wafer-to-wafer alignment and bond strength data are presented.
Published in:
3D Systems Integration Conference (3DIC), 2010 IEEE International
Date of Conference: 16-18 Nov. 2010
- Page(s):
- 1 - 4
- Print ISBN:
- 978-1-4577-0526-7
- INSPEC Accession Number:
- 11945643
- Conference Location :
- Munich
- Digital Object Identifier :
- 10.1109/3DIC.2010.5751472
- Product Type:
- Conference Publications
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