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Enabling power distribution network analysis flows for 3D ICs

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6 Author(s)
Xiang Hu ; ECE Dept., Univ. of California San Diego, La Jolla, CA, USA ; Toms, T. ; Radojcic, R. ; Nowak, M.
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This paper concentrates on some of these new challenges that designers must face in power delivery. We will discuss QUALCOMM's effort with EDA vendors to develop power distribution network (PDN) analysis flows in order to address the power delivery issues in 3DICs, and emphasize the necessity of a standard reduced power model (SRPM) to enable the 3D PDN analysis flows.

Published in:

3D Systems Integration Conference (3DIC), 2010 IEEE International

Date of Conference:

16-18 Nov. 2010

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