Skip to Main Content
In a 3D chip stack, it is important to thermally isolate any DRAMs from high power processors, so that the former can operate at low junction temperatures. One way to do this is to use the combination of a vacuum gap, formed using standard semiconductor processing, together with capacitive or inductive signaling across the gap. Simulation shows that the DRAM can operate at a temperature 47°C cooler than the CPU.
Note: PDF Not Yet Available In IEEE Xplore. The document that should appear here is not currently available. IEEE Xplore is working to obtain a replacement PDF. That PDF will be posted as soon as it is available. We regret any inconvenience in the meantime.