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3DIC multi-project fabrication run being organized by CMC/CMP/MOSIS and Tezzaron

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1 Author(s)
G. Deptuch ; Fermi Nat. Accel. Lab., Batavia, IL, USA

Presents a collection of slides covering the following topics: 3D IC multiproject fabrication; high energy physics; circuit bonding; wafer thinning; TSV; radiation detector; CMOS; wafer bonding; and SOI process.

Published in:

3D Systems Integration Conference (3DIC), 2010 IEEE International

Date of Conference:

16-18 Nov. 2010