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3DIC multi-project-wafer program: A collaboration to provide fabrication access

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1 Author(s)
Tyree, V.

A collection of slides from the author's conference presentation is given. The following topics are discussed: 3DIC multiproject-wafer program; CMP/CMC/MOSIS; MOSIS multiproject wafer; Tezzaron 3DIC technology; silicon workbench for photonics; and silicon workbench for MEMS and III-V compound semiconductors.

Published in:
3D Systems Integration Conference (3DIC), 2010 IEEE International

Date of Conference: 16-18 Nov. 2010

Page(s):
1 - 17
Print ISBN:
978-1-4577-0526-7
INSPEC Accession Number:
11945590
Conference Location :
Munich
Digital Object Identifier :
10.1109/3DIC.2010.5751416
Product Type:
Conference Publications

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