Referenced Items are not available for this document.
A yield model was developed allowing the calculation of yield using defect density data of manufacturing equipment. The approach allows studying impact of semiconductor manufacturing equipment on yield, to calculate and monitor yield during semiconductor manufacturing and predicting yield based on real time input of semiconductor manufacturing equipment regarding failures, defect density etc. The yield model bases on generic flows of manufacturing processes. The model assigns each functional layer a yield loss during the sequence of manufacturing steps. The yield model was implemented in a software code. The software was used to study yield impact of specific equipment for different technologies and products.
Published in:
Semiconductor Manufacturing (ISSM), 2010 International Symposium on
Date of Conference: 18-20 Oct. 2010
- Page(s):
- 1 - 4
- ISSN :
- 1523-553X
- E-ISBN :
- 978-4-9904138-3-5
- Print ISBN:
- 978-1-4577-0392-8
- INSPEC Accession Number:
- 11945584
- Conference Location :
- Tokyo
- Product Type:
- Conference Publications
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