Cart (Loading....) | Create Account
Close category search window
 

Measuring Joule heating and strain induced by electrical current with Moiré interferometry

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Chen, Bicheng ; Electronic Packaging Laboratory, State University of New York at Buffalo, 102 Ketter Hall, Buffalo, New York 14260, USA ; Basaran, Cemal

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.3565045 

This study proposes a new method to locate and measure the temperature of the hot spots caused by Joule Heating by measuring the free thermal expansion in-plane strain. It is demonstrated that the hotspot caused by the Joule heating in a thin metal film/plate structure can be measured by Phase shifting Moiré interferometry with continuous wavelet transform (PSMI/CWT) at the microscopic scale. A demonstration on a copper film is conducted to verify the theory under different current densities. A correlation between the current density and strain in two orthogonal directions (one in the direction of the current flow) is proposed. The method can also be used for the measurement of the Joule heating in the microscopic solid structures in the electronic packaging devices. It is shown that a linear relationship exists between current density squared and normal strains.

Published in:

Journal of Applied Physics  (Volume:109 ,  Issue: 7 )

Date of Publication:

Apr 2011

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.