By Topic

Study on Three-Dimensional Numerical Simulation of the Influence of Fin Spacing on the Power of Heat Sink and Heat Dissipation

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Jingfu Cao ; Zhengzhou Univ., Zhengzhou, China

This paper mainly studied the heat dissipation of the heat sink placing on the level of the natural convection cooling conditions by numerical is found that on the conditions of the same width of the heat sink , the power of convection heat dissipation of heat sink can't be increased by reducing spacing of fins(representing an increase of the number offins of heat sink ). By comparing the numerical simulation results of heat sink and theoretical analysis shows, there is an air stagnation zone in the heat sink of straight fins that placing on the level.The feature that there is almost no movement within the zone affected the play of natural convection of heat sink. As the narrowing of fin spacing,the area of this zone increased.There is a best numerical value of fin spacing,and there can be the maximum power of heat sink and heat dissipation under the best spacing.Over the best value, the power of heat sink and heat dissipation will be lowered because of reducing the area of fins; when under the best value, the power of heat sink and heat dissipation also will be lowered because of reducing the effective area of heat dissipation.

Published in:

Power and Energy Engineering Conference (APPEEC), 2011 Asia-Pacific

Date of Conference:

25-28 March 2011