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A 65nm CMOS fully integrated transceiver module for 60GHz wireless HD applications

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15 Author(s)
Siligaris, A. ; CEA-LETI-MINATEC, Grenoble, France ; Richard, O. ; Martineau, B. ; Mounet, C.
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This paper presents a fully integrated 60GHz transceiver module in a 65nm CMOS technology for wireless high-definition video streaming. The CMOS chip is compatible with the WirelessHD™ standard, covers the four channels and supports 16-QAM OFDM signals including the analog baseband. The ESD-protected die (9.3mm2) is flip-chipped atop a High Temperature Cofired Ceramic (HTCC) substrate, which receives also an external PA and the emission and reception glass-substrate antennas. The module occupies an area of only 13.5χ8.5mm2. It consumes 454mW in receiver mode and 1.357W in transmitter mode (357mW for the transmitter and 1W for the PA).

Published in:

Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2011 IEEE International

Date of Conference:

20-24 Feb. 2011