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An Explicit Delay Model for On-Chip VLSI RLC Interconnect

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3 Author(s)
Susmita Sahoo ; Dept. of Electron. & Commun. Eng., Nat. Inst. of Technol., Durgapur, India ; Madhumanti Datta ; Rajib Kar

On-chip inductive effects are becoming predominant in deep submicron interconnects due to increasing clock speed, circuit complexity and an increase in interconnect length. In this paper, a novel closed form delay metric has been proposed for the on-chip VLSI RLC interconnect. The model has also been extended for the case when the time of flight of the input signal is comparable. It is started with a distributed RLC line model of the interconnect and analytically solved the resulting diffusion equation for the voltage response and 50% delay has been calculated and has been compared with SPICE delay and error is within 7%. The proposed method also calculates 50% delay by taking the time of flight into consideration and result is compared with SPICE and the average error has been found to be within 6%.

Published in:

Devices and Communications (ICDeCom), 2011 International Conference on

Date of Conference:

24-25 Feb. 2011