By Topic

Differential Extrapolation Method for Separating Dielectric and Rough Conductor Losses in Printed Circuit Boards

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Koul, A. ; Cisco Syst., Inc., San Jose, CA, USA ; Koledintseva, M.Y. ; Hinaga, S. ; Drewniak, J.L.

Copper foil in printed circuit board (PCB) transmission lines/interconnects is roughened to promote adhesion to dielectric substrates. It is important to characterize PCB substrate dielectrics and correctly separate dielectric and conductor losses, especially as data rates in high-speed digital designs increase. Herein, a differential method is proposed for separating conductor and dielectric losses in PCBs with rough conductors. This approach requires at least three transmission lines with identical, or at least as close as technologically possible, basic geometry parameters of signal trace, distance-to-ground planes, and dielectric properties, while the average peak-to-valley amplitude of surface roughness of the conductor would be different. The peak-to-valley amplitude of conductor roughness is determined from scanning electron microscopy images.

Published in:

Electromagnetic Compatibility, IEEE Transactions on  (Volume:54 ,  Issue: 2 )