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Underfill Selection, Characterization, and Reliability Study for Fine-Pitch, Large Die Cu/Low-K Flip Chip Package

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15 Author(s)
Yue Ying Ong ; Inst. of Microelectron., Singapore, Singapore ; Soon Wee Ho ; Sekhar, V.N. ; Xuefen Ong
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This paper presents a systematic underfill selection and characterization methods for 21 ×21 mm2 Cu/low-K flip chip packages (65 nm technology) with 150 μm bump pitch. This paper has also correlated the underfill characterization methods with the reliability results of 15×15 mm2 and 21×21 mm2 Cu/low-K flip chip packages. From the validations of underfill selection and characterization approach with the reliability of 21×21 mm2 Cu/low-K flip chip package, it was found that the reliability results correlated well with the adhesion test results. Underfill/flux compatibility and underfill flow performance are found to be important factors during underfill selection. Underfill should not be sieved out at the initial stage without actual reliability tests.

Published in:

Components, Packaging and Manufacturing Technology, IEEE Transactions on  (Volume:1 ,  Issue: 3 )

Date of Publication:

March 2011

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