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Wafer-level hermetic packaging technology for MEMS using anodically-bondable LTCC wafer

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6 Author(s)
Tanaka, S. ; Tohoku Univ., Sendai, Japan ; Matsuzaki, S. ; Mohri, M. ; Okada, A.
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This paper describes a versatile and reliable wafer-level hermetic packaging technology using an anodically-bondable low temperature cofired ceramic (LTCC) wafer, in which electrical feedthroughs and passive components can be embedded. The hermeticity of vacuum-sealed cavities was confirmed after 3000 cycles of heat shock (-40°C/+150°C, 30 min/30 min) by diaphragm method. The width of seal rings necessary for hermetic sealing of saw-diced chips is 0.1 mm or less. Electrical connection between MEMS on a Si wafer and feedthroughs in the LTCC wafer was established using Sn-containing metal stack simultaneously with anodic bonding. The developed wafer-level hermetic packaging technology is ready for practical applications.

Published in:

Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on

Date of Conference:

23-27 Jan. 2011

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