Referenced Items are not available for this document.
This paper reports a novel room temperature hermetic liquid sealing process based on wire bonded “plugs” over the access ports of liquid-filled cavities. The method enables liquids to be integrated already at the fabrication stage. Test vehicles were manufactured and used to investigate the mechanical and hermetic properties of the seals. A helium leak rate of better than 10-10 mbarL/s was measured on the successfully sealed structures. The bond strength of the “plugs” were similar to standard wire bonds on flat surfaces.
Published in:
Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on
Date of Conference: 23-27 Jan. 2011
- Page(s):
- 356 - 359
- ISSN :
- 1084-6999
- Print ISBN:
- 978-1-4244-9632-7
- INSPEC Accession Number:
- 11875174
- Conference Location :
- Cancun
- Digital Object Identifier :
- 10.1109/MEMSYS.2011.5734435
- Product Type:
- Conference Publications
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