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This paper reports a novel room temperature hermetic liquid sealing process based on wire bonded “plugs” over the access ports of liquid-filled cavities. The method enables liquids to be integrated already at the fabrication stage. Test vehicles were manufactured and used to investigate the mechanical and hermetic properties of the seals. A helium leak rate of better than 10-10 mbarL/s was measured on the successfully sealed structures. The bond strength of the “plugs” were similar to standard wire bonds on flat surfaces.
Date of Conference: 23-27 Jan. 2011