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Heterogeneous integration technology for combination of different wafer sizes using an expandable handle substrate

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4 Author(s)
Forsberg, F. ; Microsyst. Technol. Lab., KTH -R. Inst. of Technol., Stockholm, Sweden ; Roxhed, N. ; Stemme, G. ; Niklaus, F.

This paper reports on the realization of a novel method for batch transfer of multiple separate dies from a smaller substrate onto a larger wafer substrate by using a standard matrix expander in combination with adhesive wafer bonding and an elastic dice tape. We demonstrate the expansion and transfer of about 30000 chips from a 100 mm wafer to a 200 mm wafer with a 22 μm standard deviation of positioning accuracy. Fabrication, evaluation method and results are presented.

Published in:

Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on

Date of Conference:

23-27 Jan. 2011

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